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Image of REYNOLDSTECH 200 mm Electroplating Tool
Applications

For electroplating of Indium and Silver/Tin/Antimony/Copper Solder Alloys

Capabilities
  • Open to substrates from pieces to 200mm wafers.
  • (2) Electroplating cells with drag out tanks
  • Cascade rinse tank
  • Static
  • Acid clean tank Non-contact wiper
Estimated Arrival
March 2025
Projected Availability
July 2025

This material is based upon work supported by the National Science Foundation under Grant No. NNCI-2025233. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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