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CNF Short Course: Technology and Characterization at the Nanoscale
Tuesday - Friday, June 3-6, 2008

: OVERVIEW :

All lectures are held in 203 Phillips Hall.
All Lab Sessions are in the CNF Clean Room, Duffield Hall.
Pizza Party and lunches are held in the Upson Hall Lounge.
  The Pizza Party and lunch each day are included in the cost of the course.

Day 1: Registration, Orientation & Pizza Party
Day 2: Introduction & Microfluidic Systems
Day 3: MEMS Cantilever Fabrication
Day 4: Nanoelectrode Fabrication

The course comprises fabrication techniques needed to design process sequences for many devices. We will teach how to use them by means of three specific applications: microfluidics, cantilevers, and nanoelectrodes. Each day is dedicated to the fabrication of one of these applications. After the course, attendees will be able to design processes for their own applications.



If you have a preference for which lab groups you are assigned to, please note the day and group designation on your registration.  We'll do our best to put participants in their preferred group. 



 
Registration, Orientation & Reception • Tuesday, June 3rd

5:15 pm, Registration, Welcome to CNF and the TCN, Pizza Party & Clean Room Orientation (Mandy, Mike, Edward, Garry, Beth)

 

Microfluidic Systems Fabrication • Wednesday, June 4th

8:00am Welcome & Introduction
8:05am - 9:00 am, Science at the Nanoscale, Introduction to NNIN and CNF (George Malliaras)
9:00-9:15 am, Break
9:15-9:30, Overview over TCN lectures, Introduction to the Fabrication of Microfluidic Systems (Mandy Esch, Beth Rhoades)
9:30-10:30, Introduction to Photolithography (Garry Bordonaro, or tentatively Edward Camacho)
10:45-12:30 pm, Hands-on Photolithography Lab:
  Mask Generation, Resist Application, Contact Photolithography

Group A
(togging at 10:45 am)
Group B
(togging at 11:00 am)
Group C
(togging at 11:15 am)
10:50 am PG demonstration 11:05 am PG demonstration 11:20 am PG demonstration
11:05 am - 12:30 pm in CNF cleanroom
• Spinning in the CNF photolithography room
• Exposing at EVG 620
• Developing wafers in the Hamatech in the contact aligner room
• Inspection
11:20 pm - 12:30 pm in NBTC cleanroom
• Spinning in NBTC
• Exposing at NBTC EVG 620
• Developing wafers in NBTC hood
• Inspection
11:35 am - 12:30 pm in the Teaching Lab
• Spinning in the Teaching Lab
• Exposing at Karl Suss in the Teaching Lab
• Developing wafers in the Hamatech in the stepper room
• Inspection
PG: Mandy, Edward Group A: Dan, John Group B: Mike, Edward Group C: Garry, Daron

12:30-1:30 pm, Lunch
1:30-2:30 pm, Introduction to Pattern Transfer, Deep Reactive Ion Etching (Vince Genova)
2:45-4:30 pm, Lab Demonstrations:
  Optical Microscopy, Profilometry, Deep Reactive Ion Etching, Wafer Bonding, Molecular Vapor Deposition, PDMS Fabrication

Time
Group A
(togging at 2:45p)
Group B
(togging at 3:05p)
Group C
(togging at 3:25p)
2:50 - 3:10
Microscopy
  
3:10 - 3:30
DRIE/ P10
Microscopy
 
3:30 - 3:50
Bonding/Interconnects, MVD/PDMS
DRIE/ P10
Microscopy
3:50 - 4:10  
Bonding/Interconnects, MVD/PDMS
DRIE/ P10
4:10 - 4:30   
Bonding/Interconnects, MVD/PDMS
Microscopy: Alan DRIE/P10: Meredith, student staff Bonding/Interconnects, MVD/PDMS: Mandy, Beth

 

MEMS Cantilever Fabrication • Thursday, June 5th

8:00-8:10 am, Introduction to the Process Flow for Cantilever Fabrication (Mandy Esch)
8:10-9:15 am, Introduction to Thin Films, Thermal Oxidation, Chemical Vapor Deposition, Thin Film Characterization (Phil Infante)
9:15 - 9:30 am, Break
9:30 - 10:15 am, Photolithography II (Garry Bordonaro)
10:15-10:30 am, Break
10:30-11:15 pm, Reactive Ion Etching of Thin Films, Wet Etching, Wet and Dry Release (Meredith Metzler)
11:15-11:30 am, Break
11:30-12:15 pm, Scanning Electron Microscopy (Daron Westly)
12:15-1:15 pm, Lunch
1:15-4:30, Lab Demonstrations:
  Chemical Vapor Deposition, Thin Film Measurements, Projection Photolithography, Reactive Ion Etching, Scanning Electron Microscopy

Time
Group 1
(togging at 1:15p)
Group 2
(togging at 1:35p)
Group 3
(togging at 1:55p)
Group 4
(togging at 2:15p)
Group 5
(togging at 2:35p)
1:20 - 1:40
LPCVD
    
1:40 - 2:00
PECVD
LPCVD
   
2:00 - 2:20
Filmetrics
PECVD
LPCVD
  
2:20 - 2:40
Steppers
Filmetrics
PECVD
LPCVD
 
2:40 - 3:00
RIE
Steppers
Filmetrics
PECVD
LPCVD
3:00 - 3:20
SEM
RIE
Steppers
Filmetrics
PECVD
3:20 - 3:40  
SEM
RIE
Steppers
Filmetrics
3:40 - 4:00   
SEM
RIE
Steppers
4:00 - 4:20    
SEM
RIE
4:20 - 4:40     
SEM
LPCVD: Phil PECVD: Dan Filmetrics: Rob Steppers: Garry, Mike RIE: Vince SEM: Daron

 

Nanoelectrode Fabrication • Friday, June 6th

8:00-8:10 am, Introduction to the Process Flow for the Fabrication of Nanoelectrodes
8:10-9:10 am, Electron Beam Lithography, Nano Imprint Lithography (Alan Bleier)
9:10-9:25pm, Break
9:25-10:15 am, Physical Vapor Deposition and Pattern Transfer via Lift Off (Jerry Drumheller)
10:15-10:30 am, Break
10:30-11:00 am, Atomic Force Microscopy (John Treichler)
11:00-11:30 am, Bottom Up Nanofabrication and other Fabrication Techniques (Mandy Esch)
11:30-11:45 am, Break
11:45-12:15 pm, Process Integration Considerations (Daniel Woodie)
12:15-1:15 pm, Lunch
1:15-4:20pm, Lab Demonstrations:
  Electron Beam Lithography, Evaporation, Lift Off, Sputtering, AFM, Process Integration

Time
Group 1
(togging at 1:15p)
Group 2
(togging at 1:35p)
Group 3
(togging at 1:55p)
Group 4
(togging at 2:15p)
Group 5
(togging at 2:35p)
1:20-1:40
E-beam Litho
    
1:40-2:00
Evap. / Lift Off
E-beam Litho
   
2:00-2:20
Sputtering
Evap. / Lift Off
E-beam Litho
  
2:20-2:40
AFM
Sputtering
Evap. / Lift Off
E-beam Litho
 
2:40-3:00
Process Int.
AFM
Sputtering
Evap. / Lift Off
E-beam Litho
3:00-3:20  
Process Int.
AFM
Sputtering
Evap. / Lift Off
3:20-3:40   
Process Int.
AFM
Sputtering
3:40-4:00    
Process Int.
AFM
4:00-4:20     
Process Int.
E-beam: Alan Evaporation / Lift Off: Daron, student staff Sputtering: Jerry AFM: John Process Int: Dan

 

4:30 Wrap Up

 

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