Button: Contact CNFButton: MultimediaButton: About CNF
Button: Getting StartedButton: PublicationButton: REU ProgramButton: Events & SeminarsButton: Education OutreachButton: TechnologiesButton: Lab Equipment

Button: Lab User



Cornell NanoScale Facility / Smart System Technology & Commercialization Center

Tool Map

LITHOGRAPHY
DRY ETCH
VAPOR / WET ETCH
DEPOSITION
MISC. PROCESSING
METROLOGY AND TEST
PACKAGING
CNF HOME
 
Major Area Sub-Area CNF Tool STC Tool
LITHOGRAPHY Exposure Tools: JEOL JBX9500FS E-Beam Lithography
 
JEOL 6300 E-Beam Lithography 
ASML 300C DUV 4x stepper 
AutoStep GCA200 i-line Stepper Ultratech 4X Reduction Stepper
GCA 5x g-line Stepper Ultratech 1X Stepper
Karl Suss MA6/BA6/SCIL Contact Aligner SUSS MA6/BA6 Manual Contact Aligner
EV620 Contact Aligner SUSS MA200 Automatic Contact Aligner
ABM Contact Aligner 
  
Coating Tools: CEE and Headway Manual Spinners TEL Mark VII and SVG 8800 Series Coat and Develop
Karl Suss Gamma 
Karl Suss RC8 
  
Photomask Tools: Heidelberg DWL2000 
GCA PG3600 
Hamatech-Steag Mask Processors
(Cr etch, mask clean)
Contact Aligner Mask Cleaner
  
Photolith Misc: Fusion UV cure Axcellis/Fusion M200PCU DUV photostabilizer
JBA 1000 Photoresist UV Cure 
Hamatech-Steag Wafer Developers 
Nanoimprint NX-2500 
Photoresist Hot Strip Bath NMP with Ultrasonics
SU-8 Hotplates (SU-8 hotplates 1-4) 
Photoresist Bake Hotplates 
YES Image Reversal Oven 
YES Polymide Bake Oven YES Polyimide/SU8 Cure Oven
YES Vapor Prime Oven YES Vapor Prime Oven
  Batch Develop
  
DRY ETCH Plasma Aura 1000 Resist Strip Ulvac and LAM
Branson P2000 Branson Etcher
Glen 1000 Resist Strip 
YES Asher 
  
RIE: Oxford 81 Etcher Oxford Plasmalab
80 Plus-RIE System
Oxford 82 Etcher LAM 4520
PT72 Etcher 
  
ICP RIE: Oxford 100 Etcher LAM 9400
  
DRIE (Si): PlasmaTherm Deep Si Etcher STS ASE DRIE
Unaxis 770 Deep Si Etcher STS Pegasus DRIE
  LAM DSIE
  
Chlorine/Other: PT720-740 Etcher LAM 9600
PT770 Etcher 
Trion Etcher 
Veeco Ion Mill 
  
VAPOR / WET ETCH Vapor/Gas Phase: Primaxx Vapor HF Etcher Primaxx HF Vapor
Xactix Xenon Difluoride Etcher Xactix XeF2
  
Wet Chemistries: Acid Etching Tanks
(Hot Phosphoric and Nanostrip)
Hot Phosphoric
Hamatech Hot Piranha Piranha
Hamatech Hot SC1/SC2 RCA 1 and 2
Metal Wet Etch (Au, Cr, Al, Ni, Cu, etc.) Metal Wet Etch (Al, Au, ITO, Cr)
KOH Etch Station (online 2013) KOH
HF, BOE, Pad Etch HF, BOE, Pad Etch
Baker Aleg etch residue remover chemistry EKC 265
  
DEPOSITION Furnace: Boron Doping - D1
(Boron Diffusion)
Bruce Technologies BDF-200
Carbon Nanotube/Graphene Furnace
(CNT Graphene)
MRL SBR1504
CMOS N+ Polysilicon - D3
(CMOS N+ Polysilicon)
LPCVD Tubes
CMOS Wet Oxide - E2
(CMOS Wet Oxide)
 
General Material Anneal 1 - A1
(Anneal 1)
 
LPCVD CMOS Nitride - E4
(LPCVD CMOS Nitride)
 
LPCVD LTO - B3 (LTO) 
LPCVD Nitride - B4 (Nitride) 
MOS Clean Anneal 2 - B1
(Anneal 2)
 
MOS Metal Anneal 3 - C1
(Anneal 3)
 
MOS Metal Anneal 4 - C2
(Anneal 4)
 
N+/P+ Polysilicon - C4
(N+/P+ Poly)
 
Phosphorus Doping - D2 
TFT LPCVD LTO410 - A3
(TFT LTO410)
 
TFT Polysilicon - A4
(TFT NP Poly)
 
TFT Wet/Dry Oxide - A2
(TFT Oxide)
 
Wet/Dry Oxide - B2
(Oxide)
 
MOS Clean (RCA 1+2) 
TFT MOS Clean
(RCA 1+2 for TFT substrates only)
 
  
Thin Film Deposition: SC4500 Odd-Hour Evaporator
(SC4500 Odd)
E-beam Metals Evaporation
Temescal F27A121UPG
SC4500 Even-Hour Evaporator
(SC4500 Even)
 
AJA Sputter Deposition Sputter Veeco Connexion 8 Cluster tool
CHA Evaporator Sputter AMAT Endura
CVC Sputter Deposition 
Electroplating Tanks Electroplating SFT Semcon 1500
GSI PECVD STS PECVD & Applied P5000
Oxford PECVD AMAT PECVD Centura
Oxford ALD FlexAL Cambridge Nanotech Savannah 200ALD
Parylene Deposition SCS Parylene Coater
PVD75 Sputter Deposition 
ReynoldsTech Conductive Polymer Vapor Deposition Tool 
  
MISC. PROCESSING  
Critical Point Dryer
(Tousimis CPD)
Ulvac O2 Polymer Release
Dimatix Printer SUSS Manual Bond: SB6/BA6
Hot Press SUSS Automatic Bond Cluster Tool, ABC200
Ion Implant - Eaton
(Eaton Implanter)
 
Microdrill HTI-7 Glass Frit Screenprinter
MVD 100 AMST MVD 100
PDMS Casting Station UV/Ozone Cleaning
Rapid Thermal Processer - AG8108
(RTP 8108)
 
RTA - AG610 (AG) 
SUSS SB8e Substrate Bonder 
Versalaser Cutting/Engraving Tool 
Chemical Hoods and SRDs JST Wet Benches and SEMI SRDs
  
METROLOGY and TESTING  
CV Testing Station MDC CV Tester
IV Probe Station SUSS Probe Station
Alpha Step 200 
CDE ResMap Resistivity 4-pt Probe CDE Resmap 16
FilMetrics Film Measurement Systems Filmetrics F50
FleXus Film Stress Measurement Flexus 2620
Leitz Film Measurement Nanospec 210
P10 Profilometer 1 & 2) KLA Tencor P-10 & P15 Profilometers
Rudolph AutoEL IV Ellipsometers N&K 1500
Soft Materials 4-point Probe MTI Autoscan 200
VCA Optima Contact Angle 
Woollam Spectroscopic Ellipsometer Woolam Ellipsometer
Zygo Optical Profilometer ZYGO Optical Interferometer
  
AFM - DI3100 Hitachi FESEM with EDAX
AFM - Veeco Icon 
BX51 Fluorescence Microscope 
Focused Ion Beam - Hitachi FB-2000A 
Hitachi S-900 SEM 
Nikon Eclipse L200N
and Other Optical Inspection Microscopes
Nikon Eclipse 200
Nikon Microscope Cameras 
Olympus Confocal Microscope 
SEM Sample Prep Sputtering System 
Zeiss Supra SEM 
Zeiss Ultra SEM 
Zyvex Nanoprobes for Ultra SEM 
  
PACKAGING  
Chemical Mechanical Polishing
Strasbaugh 6EC
Chemical Mechanical Polishing
Strasbaugh 6EC
Hamatech Post CMP Brushcleaner Strasbaugh nGenuity 7AAII
Wafer Dicing Saw - KS 7100 OnTrack DSS200
KS Bonder Asymtek Spectrum S820
Wire Bonder ADT 7200 Automated Dicing Saw
  Flip Chip/Die Bonding - SUSS Microtec FC150
  ATV Technologies Solder Reflow Oven
  SEC 860 Bonder
  Hermetic Package Sealing - SSEC Dry Box
  Dage Precision Industries 400
  H&K BJ815
  K&S 4700
Return to CNF Commercialization


Back to Top




Button: Search Button: Search Keywords
Cornell University
NYSTARNNINNSF