CNF - Chemical Vapor Deposition Capabilities

Equipment Overview

CNF currently operates a combination of 5 MRL 1142 and MRL Cyclone 440 furnaces. Each unit contains four thermal processing tubes currently configured to process up to 6 inch diameter wafers and provide a 40 inch flat temperature zone. Half of the furnaces are configured for low pressure
chemical vapor deposition (LPCVD) processes. At present 6 tubes are currently in operation with an additional 4 tubes to come on line in late 2005.

Current processes include:

Silicon Nitride: LPCVD silicon nitride deposited at 775-800°C. Stiochiometric Si3N4 as well as low stress/silicon rich nitride recipes available. Low stress films optimized at 200 Mpa tensile stress.

Low temperature oxide (LTO): LPCVD silane based silicon oxide process. Films deposited at 425°C with depositon rates in the 100 Å/minute range.

N+/P+ Polysilicon: LPCVD polysilicon furnace capable of depositing undoped, in-situ boron or phosphorus doped poly or amorphous films. Deposition
temperatures range from 550 to 650°C with deposited resistivities in the 2-15 mohm-cm range for doped films.

TEOS-based Silicon Dioxide: Tetraethylorthosilicate based LPCVD silicon oxide process. Deposition temperatures in the 650 to 750°C range.

TFT LTO: Diethylsilane based LPCVD silicon oxide process for TFT compatible glass substrates. Deposition temperature of 425°C.

TFT N+/P+ Poly: LPCVD polysilicon furnace for TFT compatible glass substrates capable of depositing undoped, in-situ boron or phosphorus
doped poly or amorphous films. Deposition temperatures range from 550 to 650°C with deposited resistivities in the 2-15 mohm-cm range for doped films.

Applications:

Device fabrication
n-MOS, p-MOS, CMOS, and BiCMOS devices with gate lengths to 100 nm
Polysilicon-based thin film transistors (TFTs)
Vacuum microelectronic field emitters
Micromechanical devices
Materials research
Charge structure and failure mechanisms of ultra-thin dielectrics
Metal-polysilicon interactions
Mechanical properties

Safety:

The gas delivery system for the furnaces has been designed for maximum purity and safety. Highest grade gases are used throughout. A Zellweger Analytical/MDA scientific toxic gas monitoring system provides continuous monitoring for hazardous gases and will automatically shutdown the gas delivery system and sound an alarm if hazardous gases are detected at levels well below those considered dangerous to the operators of the equipment.

LPCVD Process Library