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Standard Procedures for Mask Plate Processing

 

Automatic Mask Plate Processing Procedures

Automatic processing of mask plates can currently be performed using the Hamatech Mask Plate Processor.

  • Develop
    • Load mask into the Hamatech Mask Plate Processor with the resist side up
    • Run program number 2 for plate developing
    • Inspect mask
    • If no more development or resist descum is needed, you are ready for etch
  • Cr Etch
    • Load mask into the Hamatech Mask Plate Processor with the resist side up
    • Use Cr etch recipe 1
    • Inspect mask 
    • If no more etching is needed, you are ready for resist strip
  • Resist Strip
    • Use the resist stripping deck in the photolithography resist spinning room
    • Place your mask in the teflon cassette located in the deck
    • Place your mask in the right strip tank (AZ 300T) for 10 minutes
    • Transfer your mask to the left strip tank (AZ 300T) for 10 minutes, use green gloves
    • Transfer your mask to the dump rinse tank, press the start button, use green gloves
    • Rinser will finish and sound an alarm.  Press the reset button to stop the alarm
    • Transfer your mask into the spin rinse dryer.  Make certain that it is loaded into one of the back 5 slots of the cassette
    • Run program 5
    • Mask comes out clean and dry

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Manual Mask Plate Processing Procedures (NOT RECOMMENDED!)

  • Develop
    • Process plate with resist side up
    • 300 MIF for 1-2 min with light agitation
    • Rinse with DI H2O; blow dry
    • Inspect mask
    • If no more development or resist descum is needed, you are ready for etch
    • Dispose of your chemicals!! 
  • Cr Etch
    • Process plate with resist side down
    • Use Cr etch station in acid hood
    • Etch until pattern is completely clear (1-2 minutes)
    • Rinse with DI H2O; blow dry
    • Inspect mask 
    • If no more etch is needed, you are ready for resist strip
  • Resist Strip
    • Use the resist stripping deck in the photolithography resist spinning room
    • Place your mask in the teflon cassette located in the deck
    • Place your mask in the right strip tank (AZ 300T) for 5-10 minutes
    • Transfer your mask to the left strip tank (AZ 300T) for 5-10 minutes, use green gloves
    • Transfer your mask to the dump rinse tank, press the start button, use green gloves
    • Rinser will finish and sound an alarm.  Press the reset button to stop the alarm ton
    • Transfer your mask into the spin rinse dryer.  Make certain that it is loaded into one of the back 5 slots of the cassette
    • Run program 5
    • Mask comes out clean and dry.

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Mask Cleaning Procedures

  • Resist Removal
    • Use the resist stripping deck in the photolithography resist spinning room
    • Place your mask in the teflon cassette located in the deck
    • Place your mask in the right strip tank (AZ 300T) for 5-10 minutes
    • Transfer your mask to the left strip tank (AZ 300T) for 5-10 minutes, use green gloves
    • Transfer your mask to the dump rinse tank, press the start button, use green gloves
    • Rinser will finish and sound an alarm.  Press the reset button to stop the alarm ton
    • Transfer your mask into the spin rinse dryer.  Make certain that it is loaded into one of the back 5 slots of the cassette
    • Run program 5
    • Mask comes out clean and dry.

 

  • Automated Hot Piranha Clean

The piranha etch is a mixture of sulfuric acid, hydrogen peroxide and DI water often used at temperatues greater than 60 C.  Its name stems from its ability to rapidly remove organics.  The piranha mixture is so volatile that it poses a safety hazard even when it is not in use.  Consequently piranha must be mixed fresh and disposed of each time it is used. 

CNF operates a Hamatech Hot Piranha cleaning tool equipped with a brush cleaner.  This tool mixes piranha automatically and sprays it onto substrates using a chemical delivery system specifically designed for this purpose.  This tool can accomodate mask plates and is extremely useful for removing resist residue left behind after contact lithography.  This tool should *not* be used to strip resist from the mask during normal mask making processes.

 

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