Introduction to Atomic Layer Deposition
(Class time about 2 - 3 hours)
Tuesday, September 10, 2019
9:00 a.m. - 12:00 p.m.
340 Duffield Hall, 343 Campus Road
Cornell University, Ithaca NY
A light breakfast will be provided for those who RSVP by Thursday, September 5th
a. Motivation for Atomic Layer Deposition (ALD)
This class is designed to introduce the student to fundamental concepts and operating principles for the deposition of thin films by atomic layer deposition (ALD). It includes a discussion of the motivation behind ALD and some insights into the operational aspects of this thin film deposition technique as they impact thin film properties. Issues such as gas flows, chemical reactions, deposition rate, thermal window and the impact of enhanced plasma processing are discussed. Special consideration for balance-of-plant issues are also reviewed.
The student should achieve a general understanding of thin film deposition by ALD and be familiarized with available resources for further training. This course also includes several short quizzes to better enable the learning process. Students who attend the class can receive a personalized certificate of attendance signed by the course instructor.
Lesker U events on Atomic Layer Deposition have been held in the US, Asia & Europe.
Specific topics include:
b. The ALD Process in ideal conditions
c. Review of basic vacuum and flow regimes critical to ALD
i. Laminar Flow
ii. Viscous or turbulent flow
d. Evolution of ALD reactor designs
e. ALD in non-ideal conditions
i. The impact of Chaos
ii. Steric hindrance
iii. Thin film growth models
f. Recent Advanced in Process Design
i. Addition of Plasmas
ii. Enhanced Reactivity of Precursors and Carrier Gases
iii. Alternative Pulse Regimes
g. Impact of the ALD Process on Balance-of-Plant (ie. pumping systems)
h. Recent Examples of Device Solutions achieved using ALD
About Lesker University:
The Kurt J. Lesker Company provides a family of courses on vacuum technology, vacuum-enabled processing and hardware under the banner Lesker University. The following list is intended to describe the courses planned for 6 July 2016 so that the appropriate individuals can be invited to attend. To some extent, with prior interaction with the instructor, some customization of the course material is possible to better satisfy the unique needs of Cornell. More than 50 Lesker University events were held in the US and Europe in 2015 and more than 2,000 students have become better able to use vacuum to enable technology for a better world. The suite of courses offered through Lesker University includes introductions to basics vacuum, technology, physical vapor deposition and thin film growth models, atomic layer deposition, and vacuum system design. A current course listing is available from your local Lesker representative.
About the Presenter:
J.R. Gaines, Jr. is the Technical Director of Education at the Kurt J. Lesker Company, (Jefferson Hills, PA). The Lesker Company is a global scientific equipment manufacturer supplying materials and tools for vacuum-enabled innovation. Gaines has nearly 40 years of experience in the research, development and commercialization of advanced materials technologies in superconductivity, semiconductors, energy generation and storage. His experience includes vacuum systems, thin film deposition, cryogenics, inorganic chemistry, nanotechnology, energy storage and advanced ceramic processing. He currently develops and delivers the events. Prior to joining Kurt Lesker, J.R. worked for Lake Shore Cryotronics manufacturing temperature sensors, Superconductive Components, Inc. where he developed a line of ceramic superconductors and superconductive devices, Oak Ridge Micro-Energy where he helped commercialize solid-state thin film batteries, and the Sputtering Target Manufacturing Company where he developed a unique approach for advanced ceramic sputtering targets which was subsequently acquired by the Kurt J. Lesker Company. For more information please contact Mr. J.R. Gaines, Technical Director of Education, by phone at 01-614-446-2202 or by [EMAIL]
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