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CNF Lab and Equipment Information
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FleXus Film Stress Measurement
CAC Name: FleXus Film Stress Measurement Noncontact tool for measuring film stress. 
Manager: Jerry Drumheller
Backup: Phil Infante
Equipment Training
Training is a combination of machine demonstration, and hands on use, which takes about one hour. For training email Jerry Drumheller, drumheller@cnf.cornell.edu Description:A laser scan technique is used to measure wafer surface curvature before, and after wafer processing. Two wavelengths (670 nm and 780 nm) are available to ensure adequate reflected signal from the wafer. The calculated change in curvature is then used to calculate the stress in the film. The wafer is scanned on a hot plate which can be programed for stress vs. temperature measurements. Additional Resources:Equipment Information SheetBack to Top |
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METROLOGY
Alpha Step 200 CDE ResMap Resistivity 4-pt Probe FilMetrics Film Measurement Systems FleXus Film Stress Measurement Leitz Film Measurement P10 Profilometer Soft Materials 4-point Probe VCA Optima Contact Angle Woollam Spectroscopic Ellipsometer Zygo Optical Profilometer Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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