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FleXus Film Stress Measurement

Noncontact tool for measuring film stress.

FleXus, Film Stress Measurement Backup: Phil Infante


A laser scan technique is used to measure wafer surface curvature before, and after wafer processing. Two wavelengths (670 nm and 780 nm) are available to ensure adequate reflected signal from the wafer. The calculated change in curvature is then used to calculate the stress in the film. The wafer is scanned on a hot plate which can be programed for stress vs. temperature measurements.

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