Button: Contact CNFButton: MultimediaButton: About CNF
Button: Getting StartedButton: PublicationButton: REU ProgramButton: Events & SeminarsButton: Education OutreachButton: TechnologiesButton: Lab Equipment

Button: Lab User


Chemical Mechanical Polishing CMP - 6EC

Strasbaugh 6EC Chemical Mechanical Polishing Tool

Chemical Mechanical Polishing Tool
Manager: Rob Ilic

Description:

The Strasbaugh 6EC is a CMP tool capable of polishing 3, 4, and 6 inch whole wafers (no pieces). It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. The CMP Primer, available below, describes the basics of CMP and covers the terminology of the process. If you are considering using CMP in your process please review the document and contact the tool manager early in your planning. Early planning will make proper integration of CMP into your process much easier.

Processes Available:

  • Silicon oxide & nitride planarization
  • Tungsten damascene
  • Polysilicon damascene
  • Copper damascene
  • Oxide to Nitride selective polishing
  • Oxide to Silicon selective polishing
  • Contact staff about polishing other materials...


Additional Resources:

The CMP Primer
Tool Operating Instructions
CMP Pads & Slurries


Back to Top




Button: Search Button: Search Keywords
Cornell University
NYSTARNNINNSF

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu
Powered by ITX