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Chemical Mechanical Polishing CMP - 6EC

Strasbaugh 6EC Chemical Mechanical Polishing Tool

Chemical Mechanical Polishing Tool Backup: Rob Ilic

Description:

The Strasbaugh 6EC is a CMP tool capable of polishing 3, 4, and 6 inch whole wafers (no pieces). It can do automatic multistep polishing processes with diamond disk pad conditioning to maintain etch rates stability. The tool can be used for planarization or for damascene polishing of silicon oxide, silicon nitride, polysilicon, copper, tungsten, and other various metals. The CMP Primer, available below, describes the basics of CMP and covers the terminology of the process. If you are considering using CMP in your process please review the document and contact the tool manager early in your planning. Early planning will make proper integration of CMP into your process much easier.

Processes Available:

  • Silicon oxide & nitride planarization
  • Tungsten damascene
  • Polysilicon damascene
  • Copper damascene
  • Oxide to Nitride selective polishing
  • Oxide to Silicon selective polishing
  • Contact staff about polishing other materials...


Additional Resources:

The CMP Primer
Tool Operating Instructions
CMP Pads & Slurries


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