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Veeco Ion Mill

Ion milling system for physical sputter etching of substrates

Veeco Ion Mill Backup: John Treichler


The vacuum system is Cryo pumped, and equiped with a water cooled substrate stage which can tilt up to 90 degrees, and rotate the wafer. A 10 cm Kaufman Argon Ion beam source is used to sputter etch substrates up to 4 inch diameter. Small pieces are also easily used. Patterned etching can be done with hard masks, or very carefully with a photoresist mask. Relative removal rates for different materials are generally proportional to published sputter yield rates.

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