CNF - Lab and Equipment Information

CNF Lab and Equipment Information

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PT720-740 Etcher

CAC Name: PT720R740L

PlasmaTherm720/740 Chlorine-based RIE system for Silicon & Aluminum etching

Manager: Vince Genova

Backup: Jerry Drumheller , Meredith Metzler

Equipment Training
training is conducted on an as needed basis. Please contact V.Genova via email to schedule a session.

Description:

The 720/740 is a dual chamber loadlocked system. The right 720 side is for silicon etching with an oxide mask. The left 740 side is for aluminum etching with either a PR or oxide mask. Either chamber can accomodate up to 200mm wafers. Pieces can also be processed, using a fused silica carrier wafer for the right side and a sapphire wafer carrier wafer for the left side.

Capabilities:

Chlorine based gases: Cl2, BCl3. Fluorine based : SF6, CF4. Methane
Load locked sample introduction
Up to 8 inch wafer capability
Turbomolecular pumping

Additional Resources:

Equipment Information Sheet
Etch Baseline Data

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PlasmaTherm service visits
May 03, 2013
PlasmaTherm will have a service engineer on site to perform service on the etch tools. Here is the schedule when the tools will be unavailable:

Week of May 6: PlasmaTherm VLN DRIE - ongoing issue
Week of May 13: PT770
Week of May 20: PT770 & PT720/740

Scheduled updated 4/30 due to delays.

Please plan accordingly.

Notice Archive

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu