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PT720-740 Etcher

PlasmaTherm720/740 Chlorine-based RIE system for Silicon & Aluminum etching

PlasmaTherm SSL-720
Manager: Vince Genova
Backup: Jerry Drumheller

Description:

The 720/740 is a dual chamber loadlocked system. The right 720 side is for silicon etching with an oxide mask. The left 740 side is for aluminum etching with either a PR or oxide mask. Either chamber can accomodate up to 200mm wafers. Pieces can also be processed, using a fused silica carrier wafer for the right side and a sapphire wafer carrier wafer for the left side.

Capabilities:

  • Chlorine based gases: Cl2, BCl3. Fluorine based : SF6, CF4. Methane
  • Load locked sample introduction
  • Up to 8 inch wafer capability
  • Turbomolecular pumping


Additional Resources:

Etch Baseline Data


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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
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