CNF - Lab and Equipment Information

CNF Lab and Equipment Information

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PT72 Etcher

CAC Name: PT 72

PlasmaTherm 72 Fluorine based Reactive Ion Etcher

Manager: Meredith Metzler

Backup: Vince Genova

Equipment Training
Training is conducted on an as needed basis with groups of 4 or 5 people. Please contact M. Metzler via email to schedule a session. The training sessions will usually be on Wednesday mornings.

Description:

This 10-inch diameter parallel plate, turbo-pumped RIE system is dedicated to applications involving fluorine based plasmas including CHF3, CF4, and SF6. Applications include anisotropic etching of silicon, silicon dioxide and silicon nitride. Etch rates of common materials vary from about 10 nm/min up to 50 nm/min.

Capabilities:

Fluorine based gases CHF3, SF6, CF4
Turbo molecular pumped
Micro processor controlled
5% uniformity
10-1000 mT processing pressure
Controlled anisotropic etching
Variable gas chemistry
Selective etching

Additional Resources:

Equipment Information Sheet
Etch Baseline Data
Baseline Etch Process Flow

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PlasmaTherm service visits
May 03, 2013
PlasmaTherm will have a service engineer on site to perform service on the etch tools. Here is the schedule when the tools will be unavailable:

Week of May 6: PlasmaTherm VLN DRIE - ongoing issue
Week of May 13: PT770
Week of May 20: PT770 & PT720/740

Scheduled updated 4/30 due to delays.

Please plan accordingly.

Notice Archive

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu