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ETCHING
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Oxford 100 Etcher

CAC Name: Oxford 100

Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching

Oxford 100
Manager: Vince Genova
Backup: Meredith Metzler
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session.

Description:

The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for deep SiO2 etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.

Capabilities:

  • Fluroinated gases: CHF3, CF4, C2F6, C4F8
  • Other gases: CO2, Ar, O2, N2
  • Materials: thermal, PECVD and LPCVD oxides
  • Doped oxides: BPSG and PSG
  • Glasses: Quartz, Fused silica, and others


Additional Resources:

Equipment Information Sheet
Etch Baseline Data


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Oxford 100 available
Oct 22, 2014
The Oxford 100 is available for use. If you have any issues with it please notify staff.

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