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ETCHING
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Oxford 100 Etcher
CAC Name: Oxford 100 Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching 
Manager: Vince Genova
Backup: Meredith Metzler
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session. Description:The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for deep SiO2 etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode. Capabilities:
Additional Resources:Equipment Information SheetEtch Baseline Data Back to Top |
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PlasmaTherm service visits
May 03, 2013 PlasmaTherm will have a service engineer on site to perform service on the etch tools. Here is the schedule when the tools will be unavailable: Week of May 6: PlasmaTherm VLN DRIE - ongoing issue Week of May 13: PT770 Week of May 20: PT770 & PT720/740 Scheduled updated 4/30 due to delays. Please plan accordingly. 
ETCHING
Acid Etching Tanks Aura 1000 Resist Strip Branson Resist Strip Glen 1000 Resist Strip Hamatech Hot Piranha Hamatech Hot SC1/SC2 Oxford 100 Etcher Oxford 81 Etcher Oxford 82 Etcher PlasmaTherm Deep Si Etcher Primaxx Vapor HF Etcher PT72 Etcher PT720-740 Etcher PT770 Etcher Trion Etcher Unaxis 770 Deep Si Etcher Veeco Ion Mill Xactix Xenon Difluoride Etcher YES Asher Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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