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ETCHING
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Oxford 100 Etcher

CAC Name: Oxford 100

Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching

Oxford 100
Manager: Vince Genova
Backup: Meredith Metzler
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session.

Description:

The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for deep SiO2 etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.

Capabilities:

  • Fluroinated gases: CHF3, CF4, C2F6, C4F8
  • Other gases: CO2, Ar, O2, N2
  • Materials: thermal, PECVD and LPCVD oxides
  • Doped oxides: BPSG and PSG
  • Glasses: Quartz, Fused silica, and others


Additional Resources:

Equipment Information Sheet
Etch Baseline Data


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AJA Ion Mill Shut down dates.
Nov 26, 2014
The AJA Ion Mill will be shut down at 8:00 AM Monday December 22 so that the Grids can be sent to their manufacturer for Inspection and testing. It is expected that the grids will be returned, and the Ion Mill back up by some time Thursday January 8.

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