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Oxford 100 Etcher

CAC Name: Oxford 100

Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching

Oxford 100
Manager: Vince Genova
Backup: Tom Pennell , Christopher Alpha
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session.


The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for deep SiO2 etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.


  • Fluroinated gases: CHF3, CF4, C2F6, C4F8
  • Other gases: CO2, Ar, O2, N2
  • Materials: thermal, PECVD and LPCVD oxides
  • Doped oxides: BPSG and PSG
  • Glasses: Quartz, Fused silica, and others

Additional Resources:

Equipment Information Sheet
Etch Baseline Data

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New Digital Timers Robic Timers
Jul 21, 2015
The CNF has purchased about a dozen new Digital Robic Three Memory Timers. These are to be used by all users in the lab. They have three alarm set points, large LCD display with count up and countdown functionality and magnetic. Remember that they are property of CNF and are labeled as such. They are not to be kept in your tool boxes or your group's storage. Please keep them away
from direct contact with acids, bases, solvents or any chemistry that will bind or destroy the LCD display and butt ...more


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