ComputingCleanroom and Equipment StatusCoral - XReporter
Button: Equipment ListButton: MSDS DatabaseButton: Policies & FormsButton: Education & TrainingButton: StaffButton: Events & Seminars Button: Publication Button: About CNF Button: Lab Manual

ETCHING
     Schedule Training   ¦



Oxford 100 Etcher

CAC Name: Oxford 100

Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching

Oxford 100
Manager: Vince Genova
Backup: Meredith Metzler
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session.

Description:

The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for deep SiO2 etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.

Capabilities:

  • Fluroinated gases: CHF3, CF4, C2F6, C4F8
  • Other gases: CO2, Ar, O2, N2
  • Materials: thermal, PECVD and LPCVD oxides
  • Doped oxides: BPSG and PSG
  • Glasses: Quartz, Fused silica, and others


Additional Resources:

Equipment Information Sheet
Etch Baseline Data


Back to Top


EQUIPMENT LIST


Button: Search Button: Search Keywords
Cornell University
NYSTARNNINNSF