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Oxford 100 Etcher

CAC Name: Oxford 100

Oxford PlasmaLab 100 RIE System for fluorine based ICP deep SiO2/glass etching

Oxford 100
Manager: Vince Genova
Backup: Tom Pennell , Christopher Alpha
Equipment Training
Training is scheduled on an as needed basis. Please contact Vince Genova via email to schedule a session.


The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for deep SiO2 etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode.


  • Fluroinated gases: CHF3, CF4, C2F6, C4F8
  • Other gases: CO2, Ar, O2, N2
  • Materials: thermal, PECVD and LPCVD oxides
  • Doped oxides: BPSG and PSG
  • Glasses: Quartz, Fused silica, and others

Additional Resources:

Equipment Information Sheet
Etch Baseline Data

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Plasmatherm 770 unavailable 5/23-6/6
May 11, 2016
The PT770 will not available from 5/23-6/6. Plasmatherm will be here to do a chamber repair and upgrade on the left side. Hence, the 770 will not be accessible at all. Please plan accordingly.


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