Oxford PlasmaLab 80+ RIE System for fluorine based etching of oxide, nitride, & silicon with endpoint detection

Description:

The Oxford PlasmaLab 80+ is an 8-inch diameter parallel plate, turbo-pumped RIE system dedicated to processes involving Fluorine based gas chemistries such as CHF3, CF4, and SF6. Processes are available to anistropically etch silicon dioxide, silicon nitride, and silicon. Other gasses available are argon and oxygen.

The system has a 500 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at various temperatures. The operating pressure regime for processes in the PlasmaLab 80+ is 10 - 1000 mT.

The PC interfaced system is equipped with a laser interferometry endpoint detection scheme that can be configured to allow the PC to control and stop the etch. This also allows the etch depth to be used to control when an etch process is stopped.

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