CNF - Lab and Equipment Information

CNF Lab and Equipment Information

Schedule Training ¦

Oxford 81 Etcher

CAC Name: Oxford 81

Oxford PlasmaLab 80+ RIE System for fluorine based etching of oxide, nitride, & silicon

Manager: Meredith Metzler

Backup: Vince Genova

Equipment Training
Training is conducted on an as needed basis with groups of 4 or 5 people. Please contact M. Metzler via email to schedule a session. The training sessions will usually be on Wednesday mornings.

Description:

The Oxford PlasmaLab 80+ is an 8-inch diameter parallel plate, turbo-pumped RIE system dedicated to processes involving Fluorine based gas chemistries such as CHF3, CF4, and SF6. Processes are available to anistropically etch silicon dioxide, silicon nitride, and silicon. Other gasses available are argon and oxygen.

The system has a 500 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at various temperatures. The operating pressure regime for processes in the PlasmaLab 80+ is 10 - 1000 mT.

Additional Resources:

Equipment Information Sheet
The website for this tool at Oxford Instruments is http://www.oxford-instruments.com/PLMPDP415.htm
Etch Baseline Data
Baseline Etch Process Flow

Back to Top

Oxford 100 unavailable 6/17-6/21
Jun 14, 2013
Oxford process support will be here from
6/17-6/21 and the tool will not be
available during this time.

Notice Archive

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu