Oxford 81 Etcher
Oxford PlasmaLab 80+ RIE System for fluorine based etching of oxide, nitride, & silicon
Manager: Jeremy ClarkBackup: Vince Genova , Tom Pennell
The Oxford PlasmaLab 80+ is an 8-inch diameter parallel plate, turbo-pumped RIE system dedicated to processes involving Fluorine based gas chemistries such as CHF3, CF4, and SF6. Processes are available to anistropically etch silicon dioxide, silicon nitride, and silicon. Other gasses available are argon and oxygen.
Additional Resources:The website for this tool at Oxford Instruments is http://www.oxford-instruments.com/PLMPDP415.htm
Etch Baseline Data
Baseline Etch Process Flow
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This material is based upon work supported by the National Science Foundation under Grant No. NNCI-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
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Cornell NanoScale Science & Technology Facility (CNF)
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