CNF - Lab and Equipment Information - Aura 1000 Resist Strip

ETCHING

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Aura 1000 Resist Strip

CAC Name: AURA1000

Gasonics downstream asher for dry stripping of photoresist

Manager: Jerry Drumheller

Backup: Meredith Metzler

Description:

The Gasonics Aura 1000 utilizes a microwave source to create a stream of reactive oxygen for dry stripping of photoresist downstream from the microwave source. A heat lamp is used to raise the wafer temperature during the stripping process. The tool is setup for cassette to cassette processing of 4-inch wafers. Contact staff for information regarding other wafer sizes.

Capabilities:

No exposure of wafers to Ions...No Ion Damage.
Fully automated.
Robotic Cassette to Cassette wafer handling.
Typical one to two minute per wafer Processing.
Capable of up to 4 micron per minute removal for soft baked resist.

Additional Resources:

Equipment Information Sheet

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PlasmaTherm service visits
May 03, 2013
PlasmaTherm will have a service engineer on site to perform service on the etch tools. Here is the schedule when the tools will be unavailable:

Week of May 6: PlasmaTherm VLN DRIE - ongoing issue
Week of May 13: PT770
Week of May 20: PT770 & PT720/740

Scheduled updated 4/30 due to delays.

Please plan accordingly.

Notice Archive

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
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