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Aura 1000 Resist Strip

Gasonics downstream asher for dry stripping of photoresist

GaSonics Aura 1000
Manager: Jerry Drumheller
Backup: Meredith Metzler

Description:

The Gasonics Aura 1000 utilizes a microwave source to create a stream of reactive oxygen for dry stripping of photoresist downstream from the microwave source. A heat lamp is used to raise the wafer temperature during the stripping process. The tool is setup for cassette to cassette processing of 4-inch wafers. Contact staff for information regarding other wafer sizes.

Capabilities:

  • No exposure of wafers to Ions...No Ion Damage.
  • Fully automated.
  • Robotic Cassette to Cassette wafer handling.
  • Typical one to two minute per wafer Processing.
  • Capable of up to 4 micron per minute removal for soft baked resist.




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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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