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GSI Plasma Enhanced Chemical Vapor Deposition System

Manager: Phil Infante
Backup: Rob Ilic


The load-locked GSI Plasma Enhanced Chemical Vapor Deposition (PECVD) system can conformally deposit a variety of dielectric films as well amorphous silicon on whole 100 and 150 mm diameter wafers. Dual frequency RF power supply allows tuning of the film stress. The deposition temperature can be varied from 200 - 400 °C. Deposition rates range from 100 - 400 nm/min

Processes Available:

  • TEOS based silicon oxide: normal & low stress
  • Silicon oxide
  • Silicon nitride: stoichiometric & low stress
  • Amorphous silicon: doped and undoped
  • Oxynitrides: 1.46 - 2.0 refractive index range

Additional Resources:

GSI instructions 9_20_02 update
Process Data 6_22_05 update.xls

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