Autostep i-line Stepper
GCA Autostep 200 DSW i-line Wafer Stepper
Manager: Garry BordonaroBackup: Michael Skvarla
The Autostep 200 is a production-level 5X reduction wafer exposure tool designed for up to 200mm wafers. All operations are automated, including wafer loading (100mm wafers) and aligning, and reticle loading and aligning (5"). Wafer leveling is used to provide optimum focus range. The focus system uses broadband light and is repeatable to <0.2µm. Overlay is specified as <0.125µm using local alignment; we have seen well below that. All tool calibrations are performed automatically, and the focus system uses elaborate compensation for lens heating and barometric shifts. With N.A. of 0.45 and Sigma of 0.5, the tool is specified for 0.65µm features; we have printed <0.5µm.
Additional Resources:Alignment Mark GDS Files
Autostep Operation Manual
AS200 Resist Matrix
Autostep manuals and training notes
Back to Top
This material is based upon work supported by the National Science Foundation under Grant No. ECCS-15420819. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: firstname.lastname@example.org
Powered by ITX