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CNF Lab and Equipment Information
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Wire Bonder
Westbond 7400A Ultrasonic Wire Bonder 
Manager: Jerry Drumheller
Backup: Vince Genova
Equipment Training
Training takes about 2 hours, usually in the afternoon, and is Hands on.. It is done as needed. Email Jerry Drumheller, (drumheller@cnf.cornell.edu) Description:A wire bonder is used to connect the micron scale pads of your device to the pads, or leads in a package. This wedge-wedge ultrasonic type wire bonder is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen. Additional Resources:Equipment Information SheetBack to Top |
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PACKAGING & MISC PROCESSING
Chemical Mechanical Polishing CMP - 6EC CorSolutions Microfluidic Probe Station Critical Point Dryer Dicing Saw - KS 7100 Dimatix Printer Hamatech Post CMP Brushcleaner Hot Press Ion Implant - Eaton KS Bonder Microdrill MVD100 PDMS Casting Station Rapid Thermal Processer - AG8108 RTA - AG610 Suss SB8e Substrate Bonder Versalaser Cutting/Engraving Tool Wire Bonder Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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