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Westbond 7400A Ultrasonic Wire Bonder
Wedge-wedge ultrasonic type wire bonder Backup: Daniel McCollister , Vince Genova
Equipment Training
Training takes about 2 hours, usually in the afternoon, and is hands on. It is done as needed. Please contact the tool manager to schedule a training session.


A wire bonder is used to connect the micron scale pads of your device to the pads, or leads in a package. This wedge-wedge ultrasonic type wire bonder is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.
The tool is now located in Room 228.

Additional Resources:

Equipment Information Sheet

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