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PACKAGING & MISC PROCESSING
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Westbond 7400A Ultrasonic Wire Bonder
Wedge-wedge ultrasonic type wire bonder Backup: Vince Genova
Equipment Training
Training takes about 2 hours, usually in the afternoon, and is hands on. It is done as needed. Please contact the tool manager to schedule a training session.

Description:

A wire bonder is used to connect the micron scale pads of your device to the pads, or leads in a package. This wedge-wedge ultrasonic type wire bonder is currently being used with 1.25 mil aluminum wire. Minimum practical bond pad size is 100 microns square. It is now equiped with a Trinocular Stereo microscope, with TV camera, and viewing screen.
The tool is now located in Room 228.


Additional Resources:

Equipment Information Sheet


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Dicing Saw DOWN
Apr 17, 2014
Dicing saw is currently down. We are in the process of scheduling a service visit. If you have urgent dicing needs, please contact:
American Dicing Inc.
7845 Maltlage Drive
Liverpool, NY 13090
Phone: 315.428.1200
Fax: 315.428.1211
http://www.americandicing.com/
sales@americandicing.com

UPDATE 04/17/2014 11:29am
Purchase order for the work is being processed internally at CNF. ADT is checking to see if they have a field service engineer available either for the week of April 28th ...more

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