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CNF Lab and Equipment Information
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Dicing Saw - KS 7100
CAC Name: WAFER_SAW K&S 7100 Dicing Saw Manager: Rob Ilic
Backup: Sam Wright
Equipment Training
Training for operation of dicing saw is offered by appointment. Blade change training is offered for experienced users. Once you have used the dicing saw successfully at least 10 times in a period of the last 6 months of the request, please contact the tool manager for this training.
There are no training sessions currently scheduled.
Description:K&S 7100 is a dicing saw capable of handling 6 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the K&S 7100 approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details. Capabilities:
Processes Available:With the following blade change schedule we hope to satisfy the needs of as many users as possible: Additional Resources:Equipment Information SheetBack to Top |
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PACKAGING & MISC PROCESSING
Chemical Mechanical Polishing CMP - 6EC CorSolutions Microfluidic Probe Station Critical Point Dryer Dicing Saw - KS 7100 Dimatix Printer Hamatech Post CMP Brushcleaner Hot Press Ion Implant - Eaton KS Bonder Microdrill MVD100 PDMS Casting Station Rapid Thermal Processer - AG8108 RTA - AG610 Suss SB8e Substrate Bonder Versalaser Cutting/Engraving Tool Wire Bonder Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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