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CNF Lab and Equipment Information
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Leitz Film Measurement
Leitz Film Thickness Measurement System
Manager: Rob Ilic
Backup: Phil Infante
Equipment Training
Training is scheduled by need, please email requests for training to the tool manager.
There are no training sessions currently scheduled.
Description:The Leitz MV-SP Spectrophotometer uses optical methods to obtain quick, non-destructive thickness measurements of films from 10 nm to 15 µm thick. Measurement time is from 20 to 60 seconds and accuracy is quoted as plus-minus 3%. Measurements can be done inside geometries as small as four square micrometers (4 µm by 1 µm). Software is provided for measuring silicon dioxide, silicon nitride, polysilicon, polyimide, aluminum oxide, and photoresist. These films may be measured on silicon, aluminum, or III-V substrates. Programs are also provided for measuring the top layer of multiple film structures. In addition, other films and substrates can be added to the Leitz's library. Back to Top |
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METROLOGY
Alpha Step 200 CDE ResMap Resistivity 4-pt Probe FilMetrics Film Measurement Systems FleXus Film Stress Measurement Leitz Film Measurement P10 Profilometer Soft Materials 4-point Probe VCA Optima Contact Angle Woollam Spectroscopic Ellipsometer Zygo Optical Profilometer Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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