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EV620 Contact Aligner

Contact Lithography Exposure Tool

EV620 contact aligner
Manager: Dan Woodie
Backup: Edward Camacho

Description:

The EV620 contact aligner can be used for front side or back side alignment of 3, 4, and 6 inch wafers. It can do both contact and proximity printing as well as flood exposure of the wafers. It can also be used for the aligning of substrates prior to bonding them in the EV501 wafer bonder.

A UV filter is also available to block wavelengths below 350nm. This can improve the imaging of SU-8 and KMPR resists from Microchem.


Additional Resources:

Contact Lithography Alignment Keys
EV620 User Manual


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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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