Dicing Saw - DISCO
DISCO Dicing Saw
Manager: Sam WrightBackup: John Treichler , Michael Skvarla
DISCO is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details.
With the following blade change schedule we hope to satisfy the needs of as many users as possible:
Back to Top
This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
If you have a disability and are having trouble accessing information on this website or need materials in an alternate format, contact email@example.com for assistance.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: firstname.lastname@example.org
Powered by ITX