Oxford Cobra ICP Etcher
Oxford Cobra HBr etcher
Manager: Vince GenovaBackup: Tom Pennell , Jeremy Clark
The Oxford PlasmaPro system 100-380 is configured for nanoscale etching. The system is an inductively coupled plasma (ICP) based reactive ion etch platform with a very large plasma generation area of 380mm in diameter. This combined with the large 240mm electrode diameter allows for highly uniform etching over a 200mm sized area. The ICP is powered with a 3kw RF generator operating at 2MHz achieving plasma densities over 1E+12cm-3 enabling high etch rates and selectivities.
The system is configured for 100mm diameter wafers and is clamped with He backside cooling. Smaller substrates can be accommodated by mounting to a 100mm sapphire wafer. The tool is equipped with a wide temperature range from cyrogenic temps. (-150C) to heated electrode temps up to 400C. In addition, optical emission spectroscopy (OES)is installed to enable endpoint detection and to monitor chamber conditions. The system is loadlocked for sample entry and removal.
The tool is equipped with the following gas chemistries:
The applications of the etch system are many and include:
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
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Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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