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CNF Lab and Equipment Information
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CAC Name: TFT LTO410

MRL Industries Furnace for low temperature oxide depositions on TFT compatible substrates

MRL Furnace
Manager: Phil Infante
Backup: Aaron Windsor
Equipment Training
Training for the furnace area covers the pre-furnace MOS clean, atmospheric and LPCVD processes. It is scheduled on a need basis, please email the tool manager for training requests. Include MOS area training in the subject header. You will be notified when the next scheduled training will be by email.


The TFT Low Temperature Oxide furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH4 and O2 for silane base oxides and diethysilane (LTO410) for liquid source based oxide. Samples are restricted to silicon and TFT compatible glass materials only.


  • Low temperature deposited oxide
  • 20 nm/min dep rate at 425°C
  • LTO 410 deposited oxide at 400°C

Additional Resources:

Equipment Information Sheet
Location of tool in cleanroom (jpg)

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