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TFT Wet/Dry Oxide - A2

MRL Industries Furnace for thermal oxidation of TFT compatible substrates

Manager: Phil Infante

Description:

The TFT Oxide Furnace is an atmospheric furnace with a 42” flat zone capable of processing up to 6” diameter wafers. The furnace tube is equipped with an external torch for pyrogenic wet oxidation,O2 for dry oxidation and O2/inert mixtures, as well as an N2 anneal ambient. Samples are restricted to silicon or TFT based materials only.

Capabilities:

  • Wet and dry oxidation
  • HCL during oxidation up to a 4% level
  • Anneals in N2 ambient
  • Pieces to 6” diameter wafers can be processed
  • Maximum temperature of 1100°C




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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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