CAC Name: Gamma

Suss MicroTec Gamma Cluster Tool

Description:

The Gamma automated photoresist and wet processing system is designed to meet needs for clean, reliable and high throughput photolithography processing. The configuration is tailored to perform a variety of DUV photoresist and antireflection coatings, wafer baking, developing and spray coating for conformal resist wet processing tasks. The SUSS MicroTec Gamma system is equipped with a sender/receiver cassette for 100mm through 200mm wafers. Different wafer sizes can be processed simultaneously without any mechanical changeover.

Capabilities:

- DUV resist and ARC coating
- Wafer baking
- Wafer developing
- Conformal coating on pieces to 200mm wafers

Processes Available:

- UV-210 resist coating and baking
- AR3 coating and baking
- One configurable resist line for custom user needs
- Conformal resist coating with Alta Spray module
- Post exposure baking and 726-MIF developing

Applications:

The coating module is primarily dedicated to DUV resist and ARC processing. An additional line exists in the coating module that can be utilized for additional ARCs, such as DSK-101-312,4. However, various i-line and g-line resists can be implemented by user request. This line will only be changed if ten or more wafers require coating.

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