Gamma Automatic Coat-Develop Tool
Suss MicroTec Gamma Cluster Tool
Manager: Garry BordonaroBackup: John Treichler , Daniel McCollister
The Gamma automated photoresist and wet processing system is designed to meet needs for clean, reliable and high throughput photolithography processing. The configuration is tailored to perform a variety of DUV photoresist and antireflection coatings, wafer baking, developing and spray coating for conformal resist wet processing tasks. The SUSS MicroTec Gamma system is equipped with a sender/receiver cassette for 100mm through 200mm wafers. Different wafer sizes can be processed simultaneously without any mechanical changeover.
- DUV resist and ARC coating
- UV-210 resist coating and baking
The coating module is primarily dedicated to DUV resist and ARC processing. An additional line exists in the coating module that can be utilized for additional ARCs, such as DSK-101-312,4. However, various i-line and g-line resists can be implemented by user request. This line will only be changed if ten or more wafers require coating.
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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