Universal tool for bonding processes for micro-electro-mechanical systems

Description:

The Suss SB8e VAC substrate bonder is universal tool for bonding proses for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding and Thermal Compression Bonding. After Alignment the substrate stack are either mechanically clamped using the transport fixture or later-welded for further processing in the tool chamber. This tool can sustain wafers up-to 150mm. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar. The bonding process takes place under a controlled environment. The SB8e basic configurations consist of a basic load lock vacuum chamber with pneumatic, machine controls and a PC running the control software on Windows NT. The loading slide to hold the substrate transport fixture for secure a loading process. Inside the process chamber resides the integrated handling system for shift-free transfers of the substrate stack and the motorized Z- axis drive allowing for different bonding sequences. Hot top and bottom chucks are also found inside.

Capabilities:

Software controllable contact force of elctrode
Single pin electrode and Universal Bond tool
Double-side heating up to 550 Degress Celsius
Wafter sizes up to 8
Transport Fixture and manual loading slide
Process Enviroment Control System
Semi-automatic Process Chamber
Power Supply 0 to +/- 2000 VDC with maximum current at 15mA

Processes Available:

Anodic Bonding (AB)
Silicon Fusion Bonding (SFB)
Adhesive Bonding (ADB)
Thermal Compression Bonding (TCB)

Applications:

Microfluidics, pressure sensors, optoelectronics, MEMS, Packaging, and SOI production.

Additional Resources: