Suss SB8e Substrate Bonder
Universal tool for bonding processes for micro-electro-mechanical systems
Manager: Edward CamachoBackup: Rob Ilic
The Suss SB8e VAC substrate bonder is universal tool for bonding proses for micro-electro-mechanical system applications such as Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding and Thermal Compression Bonding. After Alignment the substrate stack are either mechanically clamped using the transport fixture or later-welded for further processing in the tool chamber. This tool can sustain wafers up-to 150mm. It can vacuum down to 5x10e-5 mbar with an overpressure up-to3 bar. The bonding process takes place under a controlled environment. The SB8e basic configurations consist of a basic load lock vacuum chamber with pneumatic, machine controls and a PC running the control software on Windows NT. The loading slide to hold the substrate transport fixture for secure a loading process. Inside the process chamber resides the integrated handling system for shift-free transfers of the substrate stack and the motorized Z- axis drive allowing for different bonding sequences. Hot top and bottom chucks are also found inside.
Software controllable contact force of elctrode
Anodic Bonding (AB)
Microfluidics, pressure sensors, optoelectronics, MEMS, Packaging, and SOI production.
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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