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THIN FILM DEPOSITION
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PVD75 Sputter Deposition
ITO Sputter Deposition System 
Manager: Aaron Windsor
Backup: Phil Infante
Description:The Kurt J. Lesker sputtering tool is currently configured to sputter Indium-Tin Oxide (ITO). The tool uses a 90% Indium /10% Tin target to reactively sputter with the oxygen introduced into the chamber. The composition of the ITO can be varied by controlling the percentage of oxygen that is introduced into the chamber. The lower the oxygen content; the more uniform, but the less transparent and more metallic the film will be. The tool has substrate rotation and heating capabilities up to 350°C. By heating the substrate you can create denser films. The tool has two platens: one for three 4" wafers and one that can handle a single wafer up to 8" in size. Uniformity ranges from 3-10% depending on how the sample is mounted. Additional Resources:Equipment Information SheetBack to Top |
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ALD service scheduled extended to May 24
May 17, 2013 The system will be unavailable until May 24. 
THIN FILM DEPOSITION
1. SC4500 Odd-Hour Evaporator 2. SC4500 Even-Hour Evaporator AJA Sputter Deposition CHA Evaporator CVC Sputter Deposition Electroplating Tanks GSI PECVD Oxford ALD FlexAL Oxford PECVD Parylene Deposition PVD75 Sputter Deposition ReynoldsTech Conductive Polymer Vapor Deposition Tool Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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