CNF Lab and Equipment Information
CAC Name: yesasher
YES CV200RFS Oxygen Plasma Asher
Manager: Jerry Drumheller
Vacuum system with Oxygen Plasma, designed for Resist Stripping and Descum. It uses a 9" diameter Hot Plate stage to control wafer temperature. The system is used to strip resist off single wafers, up to 8" diameter. The 40 KHz plasma is isolated from the wafer by a grounded, perforated metal plate.
Oxygen is used for removing organics. Nitrogen and Argon are also available for gentle cleaning and oxide removal. Typical operating pressure is 300-350 mTorr.
Resist Stripping, Patterned Resist Descum, Wafer Cleaning.
Additional Resources:Equipment Information Sheet
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Oxford 100 unavailable 6/17-6/21
Jun 14, 2013
Oxford process support will be here from
6/17-6/21 and the tool will not be
available during this time.
Acid Etching Tanks
Aura 1000 Resist Strip
Branson Resist Strip
Glen 1000 Resist Strip
Hamatech Hot Piranha
Hamatech Hot SC1/SC2
Oxford 100 Etcher
Oxford 81 Etcher
Oxford 82 Etcher
PlasmaTherm Deep Si Etcher
Primaxx Vapor HF Etcher
Unaxis 770 Deep Si Etcher
Veeco Ion Mill
Xactix Xenon Difluoride Etcher
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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