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ETCHING
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YES Asher
CAC Name: yesasher YES CV200RFS Oxygen Plasma Asher ![]() Manager: Jerry Drumheller
Backup: Michael Skvarla
Equipment Training
Training takes about a half hour and is set up as needed through e-mail. Please contact Jerry Drumheller (drumheller@cnf.cornell.edu) to set up a mutually convenient time. Description:Vacuum system with Oxygen Plasma, designed for Resist Stripping and Descum. It uses a 9" diameter Hot Plate stage to control wafer temperature. The system is used to strip resist off single wafers, up to 8" diameter. The 40 KHz plasma is isolated from the wafer by a grounded, perforated metal plate. Capabilities:
Processes Available:Oxygen is used for removing organics. Nitrogen and Argon are also available for gentle cleaning and oxide removal. Typical operating pressure is 300-350 mTorr. Applications:Resist Stripping, Patterned Resist Descum, Wafer Cleaning. Additional Resources:Equipment Information SheetBack to Top |
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ETCHING
Acid Etching Tanks AJA Ion Mill Anatech Resist Strip Aura 1000 Resist Strip Branson Resist Strip Glen 1000 Resist Strip Hamatech Hot Piranha Hamatech Hot SC1/SC2 KOH Etching Oxford 100 Etcher Oxford 81 Etcher Oxford 82 Etcher Oxford Cobra ICP Etcher PlasmaTherm Deep Si Etcher Primaxx Vapor HF Etcher PT72 Etcher PT720-740 Etcher PT770 Etcher Samco-UV-Ozone Trion Etcher Unaxis 770 Deep Si Etcher Xactix Xenon Difluoride Etcher YES Asher Back to Equipment List ![]() |
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![]() This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |