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CNF Lab and Equipment Information
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Oxford ALD FlexAL
CAC Name: ALD Atomic Layer Deposition 
Manager: Vince Genova
Backup: Rob Ilic
Equipment Training
Email equipment managers for training. Description:Atomic Layer Deposition (ALD) offers the opportunity to create precisely controlled structures for advanced semiconductor and other nanotechnology applications, by creating ultra-thin films on nanometre and sub-nanometre scales. A unique property of ALD is its ability to deposit material conformally into high aspect ratio features. The technology is widely regarded as a key enabler of the next generation of smaller semiconductor devices. Capabilities:Available thin film materials: Processes Available:Si3N4-plasma process is under development Applications:These highly uniform thin films (<50nm) can be used as high-k dielectrics and metal gates for advanced transistor fabrication, along with applications to MEMS/NEMS and photonics applications. Additional Resources:Equipment Information SheetBack to Top |
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ALD service scheduled extended to May 24
May 17, 2013 The system will be unavailable until May 24. 
THIN FILM DEPOSITION
1. SC4500 Odd-Hour Evaporator 2. SC4500 Even-Hour Evaporator AJA Sputter Deposition CHA Evaporator CVC Sputter Deposition Electroplating Tanks GSI PECVD Oxford ALD FlexAL Oxford PECVD Parylene Deposition PVD75 Sputter Deposition ReynoldsTech Conductive Polymer Vapor Deposition Tool Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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