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CNF Lab and Equipment Information
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Hot Press
Heated press for hot embossing 
Manager: Sam Wright
Backup: John Treichler
Equipment Training
Contact staff by email to request training. Description:The CRC Hot Press can be used for embossing plastic substrates using patterned templates. The tool can give up to 1600 lbf (7000 N) and can heat up to 200°C (390°F). Additional Resources:Equipment Information SheetBack to Top |
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PACKAGING & MISC PROCESSING
Chemical Mechanical Polishing CMP - 6EC CorSolutions Microfluidic Probe Station Critical Point Dryer Dicing Saw - KS 7100 Dimatix Printer Hamatech Post CMP Brushcleaner Hot Press Ion Implant - Eaton KS Bonder Microdrill MVD100 PDMS Casting Station Rapid Thermal Processer - AG8108 RTA - AG610 Suss SB8e Substrate Bonder Versalaser Cutting/Engraving Tool Wire Bonder Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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