CNF Lab and Equipment Information
Tool for printing a variety of materials onto substrates (Rm 224).
Manager: Beth RhoadesBackup: Mandy Esch
The FUJIFILM Dimatix Materials jet printer prints a broad range of fluids and inks and thereby supports a broad range of applications. It uses a MEMS piezo drop-on-demand print head in combination with an interchangeable cartridge system. The print head can be adjusted to print many different solutions. To enable optimum tuning of the printing process, the printer features drop visualization, and tunable jetting electronics for each individual of the available 16 nozzles. Users may print conductive fluids, aqueous solutions containing DNA, proteins, and enzymes, fluids that contain nanometer-sized particles as well as other suitable fluids. Dispensable drop sizes are 1 or 10 pL with a placement accuracy of 10 µm. The non-contact printing process allows for printing on both rigid and flexible materials. These include silicon, glass, ITO-coated glass, polyimide, and substrates with existing topography. With this printer in our tool set we plan to support a wide variety of applications. We are currently establishing protocols in the areas of organic electronics, photovoltaic applications, nanoparticle- based applications, and life science applications.
Waveforms are available for PEDOT, aqueous solutions containing DNA or proteins, low and high viscosity fluids, silver nanoparticle solutions, and CNT-containing solutions. The printer has been retrofitted so that as of 4/08, low-flash-point solutions can be used in the printer (subject to safety committee approval).
The printer can be used for the fabrication of organic electronics, photovoltaic applications, nanoparticle based applications, and life science applications.
Additional Resources:Equipment Information Sheet
suggested ink vendors
common viscosities and surface tensions
Back to Top
All purpose blade installed Thursday instead of Friday
May 21, 2013
Due to both Sam and Rob out on Friday, the all purpose blade will be installed on Thursday instead of Friday.
PACKAGING & MISC PROCESSING
Chemical Mechanical Polishing CMP - 6EC
CorSolutions Microfluidic Probe Station
Critical Point Dryer
Dicing Saw - KS 7100
Hamatech Post CMP Brushcleaner
Ion Implant - Eaton
PDMS Casting Station
Rapid Thermal Processer - AG8108
RTA - AG610
Suss SB8e Substrate Bonder
Versalaser Cutting/Engraving Tool
Back to Equipment List
This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: email@example.com
Powered by ITX