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CNF Lab and Equipment Information
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KS Bonder
K&S Gold Ball Bonder 
Manager: Jerry Drumheller
Equipment Training
Training takes about 2 - 4 hours, and is done as needed. Email Jerry Drumheller (drumheller@cnf.cornell.edu) Description:This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally connected to the stage, and heated to about 170 degrees C. Capabilities:Two different modes of operation are always available.. A manual Z mode allows the operator to control the bonding head vertical motion, and a Chessman mode using preset search heights can also be used. Processes Available:Applications:Additional Resources:Equipment Information SheetBack to Top |
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PACKAGING & MISC PROCESSING
Chemical Mechanical Polishing CMP - 6EC CorSolutions Microfluidic Probe Station Critical Point Dryer Dicing Saw - KS 7100 Dimatix Printer Hamatech Post CMP Brushcleaner Hot Press Ion Implant - Eaton KS Bonder Microdrill MVD100 PDMS Casting Station Rapid Thermal Processer - AG8108 RTA - AG610 Suss SB8e Substrate Bonder Versalaser Cutting/Engraving Tool Wire Bonder Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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