CNF Lab and Equipment Information
K&S Gold Ball Bonder
Manager: Jerry Drumheller
This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally coupled to the stage, and heated to about 170 degrees C.
Two different modes of operation are always available.. A manual Z mode allows the operator to control the bonding head vertical motion, and a Chessman mode using preset search heights can also be used.
Additional Resources:Equipment Information Sheet
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PACKAGING & MISC PROCESSING
Brewer Science 300 mm Hot Plate
Brewer Science 300 mm Spinner
CorSolutions Microfluidic Probe Station
Critical Point Dryer - Leica
Critical Point Dryer - Tousimis
Dicing Saw - DISCO
Hamatech Post CMP Brushcleaner
Ion Implant - Eaton
K&S Gold Ball Bonder
Logitech Orbis CMP
ObJet30 Pro 3D Printer
PDMS Casting Station
Rapid Thermal Processer - AG8108
RTA - AG610
Suss SB8e Substrate Bonder
Versalaser Cutting/Engraving Tool
Westbond 7400A Ultrasonic Wire Bonder
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
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Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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