CNF - Lab and Equipment Information

CNF Lab and Equipment Information

Schedule Training ¦

Electroplating Tanks

CAC Name: Elec Plate

Equipment for electroplating various metals

Electroplating Tank

Manager: Christopher Alpha

Backup: Daron Westly , Aaron Windsor

Equipment Training
Training is performed by request. Please contact the tool manager to discuss your application and schedule a training session.

Description:

Tanks and solutions are available for electroplating on substrates up to 6 inch wafers. Applications include electroplating copper for damascene wiring, electroplating into resist molds to form high aspect ratio structures, and deposition of thicker films (> 5 µm) on substrates.

Processes Available:

Copper
Gold
Nickel

Additional Resources:

Equipment Information Sheet

Results:

Over 2 microns of copper electroplated on a platinum seed layer using a photoresist mold.

ALD service scheduled extended to May 24
May 17, 2013
The system will be unavailable until May 24.

EQUIPMENT LIST

THIN FILM DEPOSITION

1. SC4500 Odd-Hour Evaporator
2. SC4500 Even-Hour Evaporator
AJA Sputter Deposition
CHA Evaporator
CVC Sputter Deposition
Electroplating Tanks
GSI PECVD
Oxford ALD FlexAL
Oxford PECVD
Parylene Deposition
PVD75 Sputter Deposition
ReynoldsTech Conductive Polymer Vapor Deposition Tool

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Cornell University

NYSTAR

NNIN

NSF

This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu