CNF Lab and Equipment Information
CAC Name: Elec Plate
Equipment for electroplating various metals
Manager: Christopher AlphaBackup: Daron Westly , Aaron Windsor
Tanks and solutions are available for electroplating on substrates up to 6 inch wafers. Applications include electroplating copper for damascene wiring, electroplating into resist molds to form high aspect ratio structures, and deposition of thicker films (> 5 µm) on substrates.
Additional Resources:Equipment Information Sheet
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ALD service scheduled extended to May 24
May 17, 2013
The system will be unavailable until May 24.
THIN FILM DEPOSITION
1. SC4500 Odd-Hour Evaporator
2. SC4500 Even-Hour Evaporator
AJA Sputter Deposition
CVC Sputter Deposition
Oxford ALD FlexAL
PVD75 Sputter Deposition
ReynoldsTech Conductive Polymer Vapor Deposition Tool
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: firstname.lastname@example.org
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