Magnetron Sputter system for depositing thin metal & dielectric films

Description:

A cryopumped CVC 601 sputter deposition system allows deposition of a variety of metals. A full target list is available below. Both RF and DC magnetron sputtering are available. Materials can be co- deposited from two sources onto the rotating substrate. Eight-inch sputtering targets are used, allowing uniform deposition over 3-inch to 6-inch wafers. Smaller pieces are easily used.

Capabilities:

• RF magnetron and DC magnetron sources
• Substrate bias for bias sputtering
• Cryopumped to 8E-8 Torr
• Substrate ion beam cleaning station
• Capacity: 10 - 3 inch wafers, 8 - 6 inch wafers
• Mass flow control for Argon, Nitrogen, and Oxygen

Processes Available:

Targets available (8 inch diameter)are: Al, Al+1%Si, Al+1%Si+4%Cu, Co, Cr, Cu, Mo, MoSi, Nb, Si, SiO2, Ta, Ti, TiW, W

CHANGES FOR CVC SPUTTER DEPOSITION SYSTEM RESERVATIONS:
EVERY TIME YOU RESERVE THIS MACHINE, IT IS NECESSARY THAT YOU LIST ALL YOUR TARGET REQUIREMENTS IN THE “Process” Field WHEN YOU “MAKE” YOUR RESERVATION!! ( “Process” information (Target Information) is read by “double clicking” the reservations on the schedule. Reservations, and Target Requirements must be on the schedule by 8:00 AM, one business day before the reservation. Weekends and Holidays don’t Count. (A reservation for Monday afternoon needs to be on the schedule by 8:00 Friday Morning)... EXCEPTION: If you see that machine time is available on the schedule, today, or tomorrow, and the target(s) which you need are scheduled to be in the machine, then you are welcome to immediately schedule that time, and use the machine while the targets you need are installed.

For a complete explanation of the requirements for CVC Sputter System reservations, see the document below.

Applications:

Additional Resources: