CVC Sputter Deposition
Magnetron Sputter system for depositing thin metal & dielectric films
Manager: Jerry DrumhellerBackup: Sam Wright
A cryopumped CVC 601 sputter deposition system allows deposition of a variety of metals. A full target list is available below. Both RF and DC magnetron sputtering are available. Materials can be co- deposited from two sources onto the rotating substrate. Eight-inch sputtering targets are used, allowing batch depositions over 3-inch to 6-inch wafers. Smaller pieces are easily used.
Targets available (8 inch diameter)are: Al, Al+1%Si, Al+1%Si+4%Cu, Co, Cr, Cu, Mo, MoSi, Nb, Si, SiO2, Ta, Ti, TiW, W
Additional Resources:CVC Sputter Deposition target request and changing procedures
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-15420819. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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