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YES Image Reversal Oven

Photoresist image reversal oven

YES-58SM Image Reversal Oven
Manager: Garry J. Bordonaro
Backup: Michael Skvarla

Description:

The YES 58-SM oven uses NH3 (ammonia) gas to reverse the tone of positive photoresist. This can be used to create an undercut profile in the photoresist for lift-off processing. In the reversal process, the chamber is purged of oxygen using vacuum and heat. It is then filled with 600 Torr of NH3 (ammonia) vapor. The NH3 reacts with the acid in the exposed resist rendering it insoluble in developer. The proceeding flood exposure causes acid to form in the previously unexposed areas allowing them to be removed in development, leaving behind the negative image of the first exposure. A descum process using O2 plasma is recommended after lift-off to promote good adhesion of deposited material


Additional Resources:

Image Reversal Basics
YES Image Reversal Oven Instructions


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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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