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Suss MA6-BA6 Contact Aligner

Karl Suss MA/BA 6 Contact Aligner

Karl Suss MA/BA 6 Contact Aligner
Manager: Edward Camacho
Backup: Garry Bordonaro , Rob Ilic

Description:

This contact aligner uses 280-350 nm light to expose wafers up to 150mm diameter. The system features an infrared camera for alignment to patterns on the backside of the wafer. The versitile mask holder allows both round and square plates as masks, and the sample plate accomodates small and odd-shaped substrates.

Capabilities:

  • Contact lithography system
  • Backside infrared alignment
  • Flood field exposure
  • Overlay accuracy to 1 um
  • Substrate size up to 150mm


Additional Resources:

Contact Lithography Alignment Keys
Contact Aligner Resist Matrix


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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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