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PHOTOLITHOGRAPHY
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Suss MA6-BA6 Contact Aligner
CAC Name: MA6/BA6 Karl Suss MA/BA 6 Contact Aligner 
Manager: Edward Camacho
Backup: Garry Bordonaro
, Rob Ilic
Equipment Training
Training is usually offered weekly, and often at a time convenient to the needs of the new users for the week. Please contact the tool manager for the training schedule. Description:This contact aligner uses 280-350 nm light to expose wafers up to 150mm diameter. The system features an infrared camera for alignment to patterns on the backside of the wafer. The versitile mask holder allows both round and square plates as masks, and the sample plate accomodates small and odd-shaped substrates. Capabilities:
Additional Resources:Equipment Information SheetContact Lithography Alignment Keys Contact Aligner Resist Matrix Back to Top |
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PHOTOLITHOGRAPHY
5X g-line Stepper ABM Contact Aligner ASML 300C DUV Stepper Autostep i-line Stepper EV620 Contact Aligner Fusion UV Cure Gamma Automatic Coat-Develop Tool Hamatech-Steag Mask Processors Hamatech-Steag Wafer Processors Heidelberg Mask Writer DWL2000 JBA 1000 Photoresist UV Cure Karl Suss RC-8 Manual Resist Spinners Nanoimprint NX-2500 PG Mask Writer Resist Hot Strip Bath SU-8 Hotplates Suss MA6-BA6 Contact Aligner YES Image Reversal Oven YES Polymide Bake Oven YES Vapor Prime Oven Back to Equipment List |
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This material is based upon work supported by the National Science Foundation under Grant No. ECS-0335765. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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