Karl Suss RC-8
SussTec GYRSET wafer spin tool
Manager: Edward CamachoBackup: Garry Bordonaro
The GYRSET System comprises a bell-shaped cover placed over the chuck and the substrate. During a spin cycle, the cover closes, creating a solvent-saturated atmosphere. All the parts involved in the GYRSET System rotate synchronously as does the confined air inside the cover. Turbulence, which can cause excessive thickness in the corners of the substrate, is thus eliminated. The photoresist coating is spread evenly over the entire surface.
Materials Allowed in this Spinner
Uniform coatings can be spun on any shape substrate as well as over difficult topology.
Additional Resources:Equipment Information Sheet: Karl Suss Gyrset RC-8a
Equipment Information Sheet: Karl Suss Gyrset RC-8b
User Instruction Manual Rev. 2 2007
Back to Top
This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
Voice: 607-255-2329, Fax: 607-255-8601, Email: email@example.com
Powered by ITX