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CNF Lab and Equipment Information
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Acid Etching Tanks

Tanks for hot Phosphoric acid and Nanostrip etching of wafers

Nanostrip Tank
Manager: Phil Infante
Equipment Training
Hot Phosphoric Tank - Training is by small group classes scheduled as required and takes about 30 minutes. Nanostrip - No training beyond the normal chemical orientation is required. Simply follow the directions at the tank.
There are no training sessions currently scheduled.

Description:

A wet deck with various acid etching tanks and two spray dump rinsers is available for processing wafers. All tanks are recirculated with filtration to provide clean wafer processing. The tanks are sized to handle up to a 150 mm wafer boat. The following chemistries are present in the wet deck:

Hot Phosphoric Acid - Boiling phosphoric acid is used for etching silicon nitride selectively to silicon oxide. The tank is specifically designed for nitride etching with a controller that can maintain the phosphoric acid boiling point to within 0.5°C. This setup is for electronic grade substrates only.

Nanostrip - Nanostrip is a more stable version of the commonly known pirhana etch (Sulfuric Acid / Hydrogen Peroxide) and is used to remove residual organics.


Additional Resources:

Equipment Information Sheet


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PlasmaTherm service visits
May 03, 2013
PlasmaTherm will have a service engineer on site to perform service on the etch tools. Here is the schedule when the tools will be unavailable:

Week of May 6: PlasmaTherm VLN DRIE - ongoing issue
Week of May 13: PT770
Week of May 20: PT770 & PT720/740

Scheduled updated 4/30 due to delays.

Please plan accordingly.

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